千住水溶性錫膏
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產品名稱:
千住水溶性錫膏
產品型號:
M705-515A（8）C1-T8G
產品展商:
千住金屬
產品文檔:
無相關文檔
簡單介紹
錫96.5、銀3.0、銅0.5###熔點:217-220℃###粘度:180-220Pa.s###230-260℃###要求無松香殘留的工藝，純水能輕松清洗殘留物###0-10℃
千住水溶性錫膏
的詳細介紹
千住水溶性錫膏 M705-515A(8)C1-T8G（無鹵素錫膏）及M705-WSG15為千住金屬開發之水洗性錫膏.
１．Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-515A(8)C1-T8G, using lead-free solder alloy, used
for wiring connection and so on, of electrical and electronic parts.
２．Standard
２.１ Chemical composition of solder alloy（Test method ： STM-9-1）
Composition and impurities are prescribed as following tables.
Composition ( mass% )
Ａｇ3.0 ± 0.1 /Ｃｕ0.50 ± 0.05/Ｓｎ
２.２ Melting temperature range and specific gravity of solder alloy(Reference value)
Melting temperature range ℃
Approx. 217 ～ 220
